Electroplating

Chemicals for electroplating – basic salts and intermediates for demanding electroplating applications
With the electroplating chemicals from TIB Chemicals, customers can rely on many years of experience and practice-oriented know-how: Starting with raw materials such as tin sulphate for traditional tin baths, we have been supplying our customers with high-quality metal compounds since the 1980s. In doing so, we are always reacting to new requirements, so that our portfolio is constantly expanding. This is expemlified by our metal methanesulphonates as well as our products for cyanide-free bath formulations or a fluorosurfactant-free chrome bath wetting agent.
From standard products to new developments and contract manufacturing: Electroplating from TIB Chemicals
Our electroplating know-how in the form of highly developed bath formulations is used in all applications – from a chrome sheen on decorative surfaces and filigree contacts on printed circuit boards to wear-resistant tin coatings on engine pistons and façade components made of electrolytically coloured aluminium.Our customers can alsways rely on us having raw materials available worldwide in sufficient quantities at a consistently high quality, at the right time and in a suitable form. From metal salts as bath bases to organic intermediates for special additives – it is almost always worth taking a look at the product range of TIB Chemicals. What is more, we are constantly developing new problem solutions for our customers: wherever in the world a new electroplating bath is being developed – we are always amongst the first when it comes to securing the raw materials, some of which are completely new. This expressly includes exclusive contract manufacturing.
From automotive to tin surface: Electroplating in application
Electroplating chemicals from TIB Chemicals are primarily used by specialist companies and other formulation proprietors. They serve as raw materials for formulations of galvanic processes in order to deposit decorative as well as functional surface layers. In addition to metal salts and their solutions, our organic additives are also used for special bath properties. The portfolio includes metal chemicals, especially for tin, nickel, copper and Zinc. Thanks to careful raw material selection and reliable process control, these basic salts are characterised by high quality. In addition, we have been supplying companies in the automotive supply industry for decades, where our products are used for the chemical or electrolytic tin-plating of bearings and pistons.
Indispensable for the electronics industry: Metal methanesulphonates
TIB Chemicals offers the world's broadest range of metal methanesulphonates. They are suitable for formulating electroplating baths, especially in the electronics sector – typically for depositing metal and alloy layers in printed circuit boards and connectors. Our customers’ focus on lead-free solders strongly promoted the development of such electrolytes years ago. TIB Chemicals has supported this path from the very beginning: even before the relevant directives came into effect, we ensured progress in this demanding bath chemistry segment with our basic salts. Thus, the product group of metal methane sulphonates fulfils the highest demands on purity and stability.
Trade name | Description | Chem. formula | CAS No. | |||
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Copper Salts | ||||||
Copper(II) acetate monohydrate Cu(OAc)2·H2O 6046-93-1 |
Cu(OAc)2·H2O | 6046-93-1 | ||||
Cu(OAc)2 6046-93-1 |
Cu(OAc)2 | 6046-93-1 | ||||
CuCl2·2 H2O 10125-13-0 |
CuCl2·2 H2O | 10125-13-0 | ||||
Copper(II) fluoroborate solution Cu(BF4)2 207121-39-9 |
Cu(BF4)2 | 207121-39-9 | ||||
Copper(II) nitrate hemipentahydrate Cu(NO3)2·2.5 H2O 19004-19-4 |
Cu(NO3)2·2.5 H2O | 19004-19-4 | ||||
Cu(NO3)2 3251-23-8 |
Cu(NO3)2 | 3251-23-8 | ||||
CuO 1317-38-0 |
Copper(II) oxide electroplating grade | CuO | 1317-38-0 | |||
Copper(II) sulphate solution EPG CuSO4 7758-98-7 |
CuSO4 | 7758-98-7 | ||||
Kupfer(II) pyrophosphate tetrahydrate Cu2P2O7·4 H2O 15191-80-7 |
Cu2P2O7·4 H2O | 15191-80-7 | ||||
Nickel Salts | ||||||
NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | ||||
Ni(OAc)2· 4 H2O 6018-89-9 |
Ni(OAc)2· 4 H2O | 6018-89-9 | ||||
NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | ||||
NiCO3·Ni(OH)2·x H2O 12607-70-4 |
NiCO3·Ni(OH)2·x H2O | 12607-70-4 | ||||
NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | ||||
NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | ||||
Nickel carbonate powder low dust NiCO3·Ni(OH)2·xH2O 12607-70-4 |
NiCO3·Ni(OH)2·xH2O | 12607-70-4 | ||||
NiCl2·6 H2O 7791-20-0 |
NiCl2·6 H2O | 7791-20-0 | ||||
NiCl2 7718-54-9 |
NiCl2 | 7718-54-9 | ||||
Ni(NO3)2·6H2O 13478-00-7 |
Ni(NO3)2·6H2O | 13478-00-7 | ||||
Ni(NO3)2 13138-45-9 |
Ni(NO3)2 | 13138-45-9 | ||||
Ni3(PO4)2 14448-18-1 |
Ni3(PO4)2 | 14448-18-1 | ||||
NiSO4·7 H2O 10101-98-1 |
NiSO4·7 H2O | 10101-98-1 | ||||
NiSO4 7786-81-4 |
NiSO4 | 7786-81-4 | ||||
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Tin Salts | ||||||
K2Sn(OH)6 12027-61-1 |
K2Sn(OH)6 | 12027-61-1 | ||||
Potassium hexahydroxystannate solution K2Sn(OH)6 12027-61-1 |
K2Sn(OH)6 | 12027-61-1 | ||||
Na2Sn(OH)6 12209-98-2 |
Na2Sn(OH)6 | 12209-98-2 | ||||
Sodium hexahydroxystannate solution Na2Sn(OH)6 12209-98-2 |
Na2Sn(OH)6 | 12209-98-2 | ||||
SnCl2 7772-99-8 |
SnCl2 | 7772-99-8 | ||||
SnCl2·2 H2O 10025-69-1 | |
SnCl2·2 H2O | 10025-69-1 | | ||||
SnCl2 7772-99-8 |
SnCl2 | 7772-99-8 | ||||
Sn(BF4)2 7488-55-3 |
Sn(BF4)2 | 7488-55-3 | ||||
SnO 21651-19-4 |
SnO | 21651-19-4 | ||||
Sn2P2O7 15578-26-4 |
Sn2P2O7 | 15578-26-4 | ||||
Tin(II) sulphate crystalline EPG SnSO4 7488-55-3 |
Tin(II) sulphate electroplating grade | SnSO4 | 7488-55-3 | |||
SnSO4 7488-55-3 |
SnSO4 | 7488-55-3 | ||||
Piston Plating TIB Stanal | ||||||
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For sulphuric acid pickling baths | - | - | |||
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For nitric acid pickling baths | - | - | |||
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For alkaline degreasing | - | - | |||
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Demulsifier for alkaline degreasing | - | - | |||
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For immersion tin plating on aluminium surfaces | - | - | |||
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For the electroless immersion tin plating on aluminium surfaces | - | - | |||
Zinc Salts | ||||||
ZnCl2 7646-85-7 |
Zinc chloride | ZnCl2 | 7646-85-7 | |||
Zn3(C6H5O7)2 546-46-3 |
Zinc citrate powder | Zn3(C6H5O7)2 | 546-46-3 | |||
Metal Methanesulphonates | ||||||
Bismuth(III) methanesulphonate solution 210 g/l Bi Bi(CH3SO3)3 82617-81-0 |
Bi(CH3SO3)3 | 82617-81-0 | ||||
Chromium(III) methanesulphonate solution 100 g/l Cr Cr(CH3SO3)3 55136-34-0 |
Cr(CH3SO3)3 | 55136-34-0 | ||||
Cobalt(II) methanesulphonate solution 120 g/l Co Co(CH3SO3)2 55136-37-3 |
Co(CH3SO3)2 | 55136-37-3 | ||||
Copper(II) methanesulphonate solution 125 g/l Cu Cu(CH3SO3)2 54253-62-2 |
Cu(CH3SO3)2 | 54253-62-2 | ||||
Iron(II) methanesulphonate solution 120 g/l Fe Fe(CH3SO3)2 56525-23-6 |
Fe(CH3SO3)2 | 56525-23-6 | ||||
Lead(II) methanesulphonate solution 450 g/l Pb Pb(CH3SO3)2 17570-76-2 |
Pb(CH3SO3)2 | 17570-76-2 | ||||
Nickel(II) methanesulphonate solution 100 g/l Ni Ni(CH3SO3)2 55136-38-4 |
Ni(CH3SO3)2 | 55136-38-4 | ||||
Potassium methanesulphonate solution 200 g/l Ka K(CH3SO3) 2386-56-3 |
K(CH3SO3) | 2386-56-3 | ||||
Silver(I)-methanesulphonate solution 275 g/l Ag Ag(CH3SO3) 2386-52-9 |
Ag(CH3SO3) | 2386-52-9 | ||||
Sodium methanesulphonate solution 120 g/l Na Na(CH3SO3) 2386-57-4 |
Na(CH3SO3) | 2386-57-4 | ||||
Tin(II) methanesulphonate solution 300 g/l Sn Sn(CH3SO3)2 53408-94-9 |
Sn(CH3SO3)2 | 53408-94-9 | ||||
wIndium(III) methanesulphonate solution 200 g/l In In(CH3SO3)3 128008-30-0 |
In(CH3SO3)3 | 128008-30-0 | ||||
Zinc methanesulphonate solution 120 g/l Zn Zn(CH3SO3)2 33684-80-9 |
Zn(CH3SO3)2 | 33684-80-9 | ||||
Trivalent Chromium Salts | ||||||
Chromium(III) chloride solution 50 % CrCl3 10025-73-7 |
CrCl3 | 10025-73-7 | ||||
Chromium(III) hydrogenphosphate solution 20 % Cr(H2PO4)3 59178-46-0 |
Cr(H2PO4)3 | 59178-46-0 | ||||
Chromium(III) nitrate solution 74 % Cr(NO3)3 13548-38-4 |
Cr(NO3)3 | 13548-38-4 | ||||
Chromium(III) sulphate solution 50 % Cr2(SO4)3 10101-53-8 |
Cr2(SO4)3 | 10101-53-8 | ||||
Organic Intermediates | ||||||
Low temperature alkaline degreaser
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C4H6O7S 5138-18-1 |
C4H6O7S | 5138-18-1 | ||||
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For the formulation of brightener systems | - | - | |||
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Grain refiner | |||||
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Peroxide stabiliser for pickling and brightening | - | - | |||
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Grain refiner for immersion tin plating | - | - | |||
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For the electrolytic colouring of aluminium surfaces | |||||
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For avoiding pores during electroless nickel plating | - | - | |||
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For avoiding pores during electroless nickel plating | - | - | |||
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For metal finishing applications | |||||
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Weting agent for degreasing and rinse baths | - | - | |||
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Wetting agent for copper plating baths | - | - | |||
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Wetting agent for copper plating baths | - | - | |||
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Fluorine-free wetting agent for chrome plating baths | - | - | |||
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Hydrophobing agent | - | - | |||
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De-foaming agent | - | - | |||
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Complexing agent for precious metals | - | - | |||
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Emulsifier for alkaline degreasing | - | - | |||
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For solubilising benzalacetone | - | - | |||
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For avoiding pores during electroless nickel plating | - | - | |||
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Grain refiner for tin plating baths | - | - | |||
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Brightener for alkaline zinc and zinc/nickel baths | - | - | |||
Rack Coating | ||||||
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Galvanic frame coating/PVC dip plastisol | - | - | |||
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Galvanic frame coating/PVC dip plastisol | - | - | |||
Baking varnisch | ||||||
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Emballage inner coating | - | - | |||
Sealent coatings | ||||||
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Thread sealing for gas inner pipes | |||||
Heating circulation sealents | ||||||
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Sealant / Sealing of heating installations | |||||
Others | ||||||
HBF4 16872-11-0 |
HBF4 | 16872-11-0 | ||||
Hydroxyethanesulphonic acid 70 % C2H5O3S 107-36-8 |
C2H5O3S | 107-36-8 | ||||
Pb(BF4)2 13814-96-5 |
Pb(BF4)2 | 13814-96-5 | ||||
CH2(SO3H)2 503-40-2 |
CH2(SO3H)2 | 503-40-2 | ||||
CH3SO3H 75-75-2 |
CH3SO3H | 75-75-2 | ||||
K2(CH2SO6) 6291-65-2 |
Catalyst for chromic acid electrolytes | K2(CH2SO6) | 6291-65-2 | |||
Na2S2O3 7772-98-7 |
Na2S2O3 | 7772-98-7 | ||||
Na2S2O3*5H2O 10102-17-7 |
Na2S2O3*5H2O | 10102-17-7 | ||||
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For the electroless immersion tin plating on copper and brass surfaces | - | - | |||
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For the electrolytic colouring of aluminum surfaces (ELOXAL) | - | - | |||
ZnCl2 7646-85-7 |
Zinc chloride solution 38-40 % standard | ZnCl2 | 7646-85-7 | |||
ZnCl2 7646-85-7 |
Zinc chloride solution 50 % | ZnCl2 | 7646-85-7 | |||
ZnCl2 7646-85-7 |
Zinc chloride solution 65 % | ZnCl2 | 7646-85-7 | |||
ZnCl2 7646-85-7 |
Zinc chloride solution 65 % | ZnCl2 | 7646-85-7 | |||
ZnCl2 7646-85-7 |
Zinc chloride solution 40 % high quality | ZnCl2 | 7646-85-7 | |||
ZnCl2 7646-85-7 |
Zinc chloride solution 40 % highest quality | ZnCl2 | 7646-85-7 |
Our products
in the range Electroplating
- Show all 104
- Copper Salts 9
- Nickel Salts 15
- Tin Salts 12
- Piston Plating TIB Stanal 6
- Zinc Salts 2
- Metal Methanesulphonates 13
- Trivalent Chromium Salts 4
- Organic Intermediates 22
- Rack Coating 2
- Baking varnisch 1
- Sealent coatings 1
- Heating circulation sealents 1
- Others 16